Lead Free Selective Soldering - The Future is Now

April 17, 2007 - Bannockburn, IL

 

This workshop will provide case histories and examples where selective
soldering has been implemented. To complete your knowledge of the
selective soldering process, it will also describe the proper
understanding of component limitations, clearance restrictions, and
thermal requirements and solder joint reliability issues.

 

You will learn about the following topics: what selective soldering is,
technology drivers, the benefits of selective soldering, selective
soldering methods, advantages and disadvantages of various methods,
design guidelines, selecting the right system for an application, case
histories, increasing role of selective soldering, and future trends.

  

The workshop instructor, Bob Klenke, is a mechanical engineer with over
25 years of experience in the electronics assembly industry,
particularly in selective soldering. He is a principal consultant of ITM
Consulting, an international consulting firm. Klenke is also president
and founder of RHK Associates. 

 

To register for this workshop, please cut and paste www.ipc.org/LFS0407
and download the registration form.

 

Lead Free SMT Manufacturing and Troubleshooting 

April 18, 2007 - Bannockburn, IL 

 

This course will give the participant an in-depth understanding of SMT
assembly using lead free solder alloys. The various aspects of no-lead
solder are examined including why the drive for lead free electronic
manufacturing, as well as which lead free alloys are being considered,
and by whom. The pros and cons of candidate solder alloys are discussed
and put into an applications-specific perspective. 

 

The second part of the course will contend with the implications of lead
free on the SMT assembly process. Interactions with substrate finishes
and components will be discussed as will the far-reaching implications
and process adaptations that must be made to accommodate no-lead
soldering. 

 

Topics to be covered are: why lead is a concern in electronics, status
of lead free in the world, lead free alloy directions, wave-solder
alloys, impact of no lead on SMT assembly, OEM vs. CEM impacts,
alternatives and enhancements to lead free electronic assembly, casual
mini-audit (review of current assembly facility, if applicable).

 

The workshop instructor, Phil Zarrow is President and co-founder of ITM,
Incorporated. He has been involved with hybrid and PCB assembly for more
than 26 years, has chaired and instructed at numerous seminars and
conferences and has been involved with setup and troubleshooting
through-hole and SMT processes throughout the world.

 

To register for this workshop, please cut and paste
www.ipc.org/LFSMT0407 into your browser and download the registration
form.

 

 

 

 


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