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February 2007

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Subject:
From:
Daniel Blass <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Daniel Blass <[log in to unmask]>
Date:
Tue, 27 Feb 2007 13:51:48 -0600
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We know of two possibilities for .4" thick boards. One is Endicott
Interconnect. Another is Sanmina's Santa Clara facility.


Daniel Blass
Process Research Engineer
Area Array Consortium
Advanced Process Laboratory at Unovis Solutions
Visit us on the web at www.unovissolutions.com and www.us-apl.com

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