I am looking for guidance on using vias in pads of surface mount
components.  The concept is great for high speed design, since it gives
the least inductance for mounting bypass caps.  It sounds easy, but I'm
sure there are some pitfalls and there may be some rules I will break.
Any guidance towards documents on this combination would be appreciated.
Also, any stories to scare me away from this approach will be fun to
hear.

Later,
Carl





Carl Van Wormer
Cipher Systems
1800 NW 169th Place, Suite B-100
Beaverton, OR  97006
Phone (503)-617-7447 extension 20    

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