Dear   Tech  Netter..
Any one   in  forum  ever  facing  solder    ball   beneath   of  the chip 
 cap  and  chip  resistor  ?  FYI  our  stencil  thickness  is  7  Mils 
and  majority  happen  on  1206  part   size.  Also   the   raw  PCB   it 
self  have  mask  with  thickness   around  1  Mils  which   defenetely 
increase  the   solder   paste  thickness  after  printing.   Any  thing 
we  can  do  with  decrease  stencil   thickness  or   stencil  opening to 
 resolve  this   issue  ?
Highly  appreciate   your   advice .

****************************************************
Regards... 
Marsal GM Tampubolon.
Senior   Quality   Engineer
CEI  Contract  Manufacturing, Singapore.
Batam  Plant,  Indonesia.

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