TECHNET Archives

February 2007

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
Date:
Fri, 23 Feb 2007 08:00:53 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (48 lines)
This is likely a case where the pads are being etched back as the
sidewall of the inside pad/hole interface is copper and not tin plated.
The basic "unwritten" rule for voiding is .005" maximum which will allow
for adequate wetting to the hole/lead.  A better process (and cheaper)
is to use print and etch like an internal layer - this eliminates the
voiding issue completely.  

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dan Skweres
Sent: Thursday, February 22, 2007 11:41 AM
To: [log in to unmask]
Subject: [TN] "Fisheyes"

Good morning. Does anyone know of any acceptability criteria for "fish
eyes" or a thin void of copper around holes on single-sided boards? At
times there's a complete cirmcumfrential void and other instances
there's only a very small amount of copper missing. Thanks in advance
for any assistance!
Dan


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2