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February 2007

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Subject:
From:
Karl Hunsinger <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Karl Hunsinger <[log in to unmask]>
Date:
Fri, 23 Feb 2007 08:24:16 -0500
Content-Type:
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text/plain (103 lines)
Stadem,
	Sorry, that was a lame attempt at humor. For information, I work for a PWB company. We produce flexible and rigid-flex PWB's.
We only use IAg here, but that's the only capability we have. We send our parts out for ENIG.
I don't know the history of our success with IAg, but my recent experiences leave a lot to be desired.
We have problems with exposed solder, and gold run under. (Under the cover coat of a double sided flex circuit.) As well as gold flaking.
It's probably good that we only have limited dealings with SMT, and no dealings with BGA's.

Since I'm writing, I have to say thanks to all on TechNet. I've learned so much here that I wouldn't have known about otherwise.

Sincerely,

Karl 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Stadem, Richard D.
Sent: Thursday, February 22, 2007 4:24 PM
To: [log in to unmask]
Subject: Re: [TN] <WL>Re: [TN] Immersion silver handling


Karl, I believe Gary meant his customer prefers ENIG finishes versus
IAg, not literally gold over silver. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gary Warner
Sent: Thursday, February 22, 2007 2:43 PM
To: [log in to unmask]
Subject: Re: [TN] <WL>Re: [TN] Immersion silver handling

ENIG is a better service, longer shelf life and not as tempermental to
environment or handling conditions.
Gary




At 01:08 PM 02/22/2007, you wrote:
> >What about gold immersion? A board assembly house indicated they
> >preferred gold over silver. Is gold easier to handle?
>
>We prefer gold over nickel, but that's just my five cents.
>
>
>
>Karl Hunsinger
>Project Engineering
>Flexible Circuits Inc.
>
>
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