An ENIG PWB presents little in the way of packaging/storage requirements
except safe handling issues. The gold prevents any oxidation. 
However, on a separate note, ENIG has some major solderability issues.
You may wish to become educated in those. The best way to do so is to
google the terms "dissolution rate of nickel into tin", "black pad",
"brittle interfacial fracture" etc. There are a lot of good articles on
that subject. Better yet, just google "Werner Engelmaier" and you will
get all of the real information without any BS.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Upton, Shawn
Sent: Thursday, February 22, 2007 11:45 AM
To: [log in to unmask]
Subject: Re: [TN] Immersion silver handling

What about gold imersion?  A board assembly house indicated they
prefered gold over silver.  Is gold easier to handle?

Shawn Upton, KB1CKT
Test Engineer
Allegro MicroSystems, Inc
[log in to unmask]
603.626.2429/fax: 603.641.5336

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Thursday, February 22, 2007 12:10 PM
To: [log in to unmask]
Subject: Re: [TN] Immersion silver handling

Do not delay between assembling the front and back of the board.

Wear gloves when handling

Do not open until ready to use them and make sure the vendor supplies
them with silver saver interleave paper

Be very careful on washing off mis-printed boards not to contaminate or
degrade the surface.

Just a few thoughts I am sure others will have more.

John

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