Hi,
   
  Recently, we have a defect for through hole un-fill in lead free wave soldering process.
   
  PCB board thickness: 94 mil
  PCB surface finish: OSP(For high temperature type)
  Wave soldering alloy material: Sn-Ag-Cu
   
  Any through hole size have the same defect.
   
  Does anyone understand how to overcome this defect or have related research for that?
   
  Best regards
   
  Leo

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