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February 2007

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Subject:
From:
"Roberts, Jon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Roberts, Jon
Date:
Wed, 21 Feb 2007 10:12:45 -0600
Content-Type:
text/plain
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text/plain (70 lines)
Jim, 
Our experience says no to baking on tape and reel or tubes (tape and reel
not marked with any temperature information will start to melt).  I had to
find waffle trays from our stack of them with the space and height to
accommodate the parts (will not be exact). We removed the parts from the
tape and reel near the temperature chamber, place them inside two trays (one
on top of the other),taped together using kapton tape and then place into
the temperature chamber.  
We have at least two oops leaving on tape and reel or in tubes so hopes this
helps, Jon


-----Original Message-----
From: West, Jim [mailto:[log in to unmask]] 
Sent: Wednesday, February 21, 2007 9:02 AM
To: [log in to unmask]
Subject: [TN] Baking Moisture sensitive devices that are on a real.

We have a PQFP-64 that we received on a real and the moisture sensitivity
level is 3.  The package has been opened and has exceeded the maximum
exposure time and requires the component to be baked for a minimum of 8hrs @
125°C.  In the past we received these on trays and baking them was not an
issue.  Can I bake these while on the reel?  Do we need to extend the baking
time?
 
Thanks,
 


Jim West
Engineering Manager
Nexergy Inc.
www.nexergy.com
tel: (614) 351-6216
fax: (614) 324-1979



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