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February 2007

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Subject:
From:
Genny Gibbard <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Genny Gibbard <[log in to unmask]>
Date:
Wed, 21 Feb 2007 09:18:31 -0600
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 I think you need to download J-STD-033B.
http://www.jedec.org/download/search/jstd033b01.pdf
You can bake for longer periods of time at lower temperatures for low temperature carriers, but you have to be able to maintain <5% humidity, if you do so.
Look at table 4-1.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of West, Jim
Sent: February 21, 2007 9:02 AM
To: [log in to unmask]
Subject: [TN] Baking Moisture sensitive devices that are on a real.

We have a PQFP-64 that we received on a real and the moisture sensitivity level is 3.  The package has been opened and has exceeded the maximum exposure time and requires the component to be baked for a minimum of 8hrs @ 125°C.  In the past we received these on trays and baking them was not an issue.  Can I bake these while on the reel?  Do we need to extend the baking time?
 
Thanks,
 


Jim West
Engineering Manager
Nexergy Inc.
www.nexergy.com
tel: (614) 351-6216
fax: (614) 324-1979



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