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February 2007

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Subject:
Re: Traces between 0402 pads
From:
"Hogg, Blair K." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hogg, Blair K.
Date:
Sun, 18 Feb 2007 10:43:45 -0500
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Our process engineer has a conniption when the designers put traces between the pads (under the component) on 1206 and 0805 components. He claims that the thickess of the copper and soldermask may be enough to hit the bottom of the component and cause problems in soldering.
 
Blair

________________________________

From: TechNet on behalf of Tempea, Ioan
Sent: Fri 2/16/2007 8:39 AM
To: [log in to unmask]
Subject: Re: [TN] Traces between 0402 pads



> Dear colleagues,
>
> is there any standard saying that traces should not be routed between 0402 pads, i.e. under the component? I have a serious discussion and really need to back it up with a formal document.
>
> Thanks,
>
> Ioan

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