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February 2007

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From:
Jack Crawford <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jack Crawford <[log in to unmask]>
Date:
Thu, 15 Feb 2007 16:56:23 -0600
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IPC-A-610 and J-STD-001 are complementary standards but each has a special purpose. IPC-A-610 is a visual acceptance standard. It has criteria and illustrations to show what connections need to be AFTER assembly. There is nothing in IPC-A-610 related to assembly processes or materials. IPC-A-610 is intended for use as a visual acceptance standard. It has illustrations to help operators and inspectors understand the written requirements. It does not invoke the use of any test methods and "most" acceptance criteria is relative in nature (not requiring the use of test instruments).

J-STD-001, on the other hand, is a materials and process requirements standard, as well as providing acceptance criteria. J001 has requirements that have to be followed when assembling the product. Building product to J-STD-001 may require the use of test methods to develop data, and use of tables in the standard to determine whether the resultant data is acceptable. It also requires that the assembly processes be defined and followed. When J-STD-001 is invoked, use of the wrong material or unacceptable process(es) would require that the resultant hardware be dispositioned by a material review board to determine what corrective action, if any, is to be taken.

Here are a couple of examples.

Process example:
Let's say that you have an assembly that has components on it that are known to be damaged by too much heat in the assembly process. J001 states that an assembly process has to be developed AND followed. So at the end of assembly, the inspector looks at all the solder connections and they look great--almost A-610 "Target" on everything.  However, in reviewing the assembly process logs (as would be required by J001), it's discovered that the reflow operator loaded the wrong profile and the boards were processed 20 º hotter than the temperature known to damage the components. J001 would provide the criteria to reject the assemblies (because of probable degradation/failure mechanism from heat damage) even though the solder connections look acceptable to 610. A similar example could be made for improper ESD control during handling that wouldn't be apparent in visual inspection.

Materials example:
The drawings require assembly with a special high-temp solder (Sn96 for example) because the assembly is used someplace that operates very hot. After inspection, it's noted that all fillet and wetting requirements are very good, once again representing very close to A-610 Target conditions. However, review of the assembly process discovers that the assemblies were made on the normal eutectic assembly line. If placed in service, the solder would be very close to plastic state or maybe even reflow, and the assembly would fail. J001 provides the requirements to reject the assemblies because the wrong materials were used, but 610 doesn't address that.

J001 has a history of being used for Class 3 "critical need" products (military, avionics, medical) and 610 was used primarily by the Class 1 & 2 commercial product manufacturers. However, many companies now subcontract to build products for many different markets. End users in particular like the "you shall..." concept of J001 so they know how their assembly was built, and "it is..." concept of 610 for final inspection. Many companies now use both standards.

Where there is common criteria (component placement and soldering) there is virtually no conflict between J001D and 610D. However, each of the standards has content specific to the document's scope/purpose. There are also a few instances where one of the documents has more or less criteria for a specific connection than the other document.  J001 requires the use of test methods for some items, as well as process control. 610 does NOT call out the use of test methods, it is for VISUAL inspection.

If you participate in the IPC tng/cert programs, there are some differences as well. 610 tng is to assure that users can find and understand the criteria that's in the standard. J001 tng has that same approach--find and understand--but also adds optional hand soldering workmanship training.

Many companies now use these standards together. However, it is important to note that when multiple standards are called out, it is critical that the procurement documentation define which standard will take precedence in the case of a dispute.

Jack Crawford, IOM
IPC Director Certification and Assembly Technology
[log in to unmask]
847-597-2893
FAX  847-615-5693
3000 Lakeside Drive, Suite 309 S
Bannockburn, IL, 60015

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dale Ritzen
Sent: Thursday, February 15, 2007 7:07 AM
To: [log in to unmask]
Subject: [TN] Differences - Similarities between J-STD-001 and IPC-A-610

After reviewing each of these documents I have to ask - why have both? They cross over on so many lines I stopped counting. I suppose I'm missing the most obvious, but it looks like we have some unnecessary duplication here. 

Need your opinions, please (humble or otherwise)... Why have both? What are the intrinsic differences between them that make it imperative to have both?
There must be some since we still use both. Can they be combined into one, all encompassing document? If not, why not?

Just waxing philosophical this morning and would like your opinions in the matter.

Thanks in advance,
Dale Ritzen
Quality Manager
Austin Manufacturing Services

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