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February 2007

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Subject:
From:
Gabriela Bogdan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gabriela Bogdan <[log in to unmask]>
Date:
Thu, 15 Feb 2007 20:03:09 +0300
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Thank you very much!
I can not be at APEX, but I will eventually send a collegue who is going 
there anyway.
Gaby
----- Original Message ----- 
From: "Bill Coleman" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, February 15, 2007 7:46 PM
Subject: Re: [TN] stencil apertures


> Hi Gaby
>
> As Russ states IPC 7525 is a good reference for stencil aperture design. 
> Revision A of this document is being released at APEX this month.  It has 
> been updated to deal with Lead-free among other things.  I have attached a 
> design help tool for Aperture Design and Stencil Selection (Area Ratio 
> Calculator).  This tool can also be seen at the Innovative Technology 
> Center at APEX in LA.
>
> Regards,
>
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Gabriela Bogdan
> Sent: Thursday, February 15, 2007 8:19 AM
> To: [log in to unmask]
> Subject: [TN] stencil apertures
>
>
> Dear all,
>
> Could you tell me if there is a standard for stencil apertures CORNER 
> RADIUS?
> I look for indications or requirements coming from people with hands on 
> experience regarding differences between the manufacturability of stencils 
> with all methods (etching, laser, electroforming) as well as best solder 
> paste release quality.
> I am also interested in aperture optimization for lead free pastes.
>
> Gaby
>
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