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Date: | Thu, 15 Feb 2007 20:03:09 +0300 |
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Thank you very much!
I can not be at APEX, but I will eventually send a collegue who is going
there anyway.
Gaby
----- Original Message -----
From: "Bill Coleman" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, February 15, 2007 7:46 PM
Subject: Re: [TN] stencil apertures
> Hi Gaby
>
> As Russ states IPC 7525 is a good reference for stencil aperture design.
> Revision A of this document is being released at APEX this month. It has
> been updated to deal with Lead-free among other things. I have attached a
> design help tool for Aperture Design and Stencil Selection (Area Ratio
> Calculator). This tool can also be seen at the Innovative Technology
> Center at APEX in LA.
>
> Regards,
>
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Gabriela Bogdan
> Sent: Thursday, February 15, 2007 8:19 AM
> To: [log in to unmask]
> Subject: [TN] stencil apertures
>
>
> Dear all,
>
> Could you tell me if there is a standard for stencil apertures CORNER
> RADIUS?
> I look for indications or requirements coming from people with hands on
> experience regarding differences between the manufacturability of stencils
> with all methods (etching, laser, electroforming) as well as best solder
> paste release quality.
> I am also interested in aperture optimization for lead free pastes.
>
> Gaby
>
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Technet Mail List provided as a service by IPC using LISTSERV 1.8e
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the BODY (NOT the subject field): SIGNOFF Technet
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Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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