IPC is offering two workshops that discuss the topics concerning Lead
Free Selective Soldering and Lead Free SMT Manufacturing and
Troubleshooting! Both will be held here at IPC headquarters, in
Bannockburn, IL.
Lead Free Selective Soldering
Tuesday, April 17, 2007
Bannockburn, IL
One of the critical issues board level assemblers are facing is forming
through-hole interconnections on circuit boards of ever-increasing
densities. IPC is holding a course which provides an overview of
site-specific selective soldering and describes the most common methods
available including aperture pallets, fountain soldering, solder robots,
laser soldering, focused light, molten wave and multi-wave. Selective
soldering with lead free alloys will be discussed in detail. The course
will review actual case histories and examples where selective soldering
has been implemented and the corresponding benefits.
The instructor is Bob Klenke, who is a mechanical engineer with over 25
years of experience in the electronics assembly industry, particularly
in selective soldering. He is a principal consultant of ITM Consulting,
an international consulting firm. Klenke is also president and founder
of RHK Associates. He has presented numerous papers at international
conferences.
To register for this informative workshop, please cut and paste the
following into your browser:
http://www.ipc.org/calendar/2007/LFSelective_Workshop_04_17_07/LFSelecti
ve_04_17.htm
<http://www.ipc.org/calendar/2007/LFSelective_Workshop_04_17_07/LFSelect
ive_04_17.htm> and download and complete the registration form to
attend this workhop.
Lead Free SMT Manufacturing and Troubleshooting
April 18, 2007
Bannockburn, IL
While other courses and workshops discuss aspects of lead free alloys,
this course examines what lead free means to the electronic assembler at
the process and logistics level. This course will give the participant
an in-depth understanding of SMT assembly using lead free solder alloys.
The various aspects of no-lead solder are examined including why the
drive for lead free electronic manufacturing, as well as which lead free
alloys are being considered, and by whom. The pros and cons of candidate
solder alloys are discussed and put into an applications-specific
perspective.
The second part of the course will contend with the implications of lead
free on the SMT assembly process. Interactions with substrate finishes
and components will be discussed as will the far-reaching implications
and process adaptations that must be made to accommodate no-lead
soldering. The impact upon printing, placement, reflow and inspection
will be examined, as well as the adaptations that have to be made by the
purchasing, quality assurance and product development groups. The
situations confronted by both OEMs and CEMs will also be examined.
This workshop is being taught by Phil Zarrow, who is President and
co-founder of ITM, Incorporated. He has been involved with hybrid and
PCB assembly for more than 26 years, has chaired and instructed at
numerous seminars and conferences and has been involved with setup and
troubleshooting through-hole and SMT processes throughout the world.
To register for this informative workshop, please cut and paste the
following into your browser:
http://www.ipc.org/calendar/2007/LFSMTManufacturing_Workshop_04_18_07/LF
SMT_04_18.htm
<http://www.ipc.org/calendar/2007/LFSMTManufacturing_Workshop_04_18_07/L
FSMT_04_18.htm> and download and complete the registration form to
attend this workshop.
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