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February 2007

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Subject:
From:
Graham Naisbitt <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Graham Naisbitt <[log in to unmask]>
Date:
Tue, 13 Feb 2007 16:57:51 +0000
Content-Type:
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text/plain (47 lines)
Thanks Werner

The modern systems are far better.

BTW, can y'all stop sending us your rotten weather? We almost have  
our own vapour phase over here.

Kindest regards,

Graham Naisbitt

[log in to unmask]



On 13 Feb 2007, at 15:28, [log in to unmask] wrote:

> Hi Graham,
> You are absolutely right, with the LF-solders, vapor phase  
> soldering is the way to go, because of
> (1) assured uniform temperatures, everywhere, and
> (2) soldering just above Liquidus is possible avoiding the much  
> higher peak reflow temperatures needed because of the thermal  
> gradients resulting from all other heat transfer modes.
>
> Unfortunately, this technically very elegant way of reflowing  
> solder got a black eye in its earlt history, because oven  
> manufacturers designed their oven improperly in terms in  
> insufficient pre-heating capability [resulting in solder pooling up  
> component leads] and insufficient sealing [resulting in expensive  
> vapor fluid losses].
>
>
>
> Werner


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