Hi All,
 I have a question/poll if you will. How many of you out there are having to produce/manufacture product that has Lead Free BGA Devices in a tin lead solder process? I have encountered this issue over 4 times in the last couple of months where a component manufacture changed the part number and for a number of reasons it was not caught until we had to replaced a that BGA Device in a post SMT Rework process. Just curious if others are experiencing this and if so what are you doing to address the issue (excluding product redesign and qualifying alternative components)? 

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