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February 2007

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 12 Feb 2007 14:30:15 EST
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text/plain
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Hi Richard,
Ingemar is absolutely correctthe only way you know what the t's are at the 
solder balls is to put thermocouples in them. It is indeed standar5d procedure 
see IPC-7530, 7.9.5.
BGA solder balls get heated by conduction through the PCBmany people do not 
realize thisand BGA component body is in fact a heat sink and a shield 
preventing both convection and radiation heat transfer.

Regards,
Werner Engelmaier
可靠性先生
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
Werner Engelmaier

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