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Date: | Mon, 12 Feb 2007 14:30:15 EST |
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Hi Richard,
Ingemar is absolutely correctthe only way you know what the t's are at the
solder balls is to put thermocouples in them. It is indeed standar5d procedure
see IPC-7530, 7.9.5.
BGA solder balls get heated by conduction through the PCBmany people do not
realize thisand BGA component body is in fact a heat sink and a shield
preventing both convection and radiation heat transfer.
Regards,
Werner Engelmaier
可靠性先生
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
Werner Engelmaier
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