Dear Tech Netter..
Any one in forum ever facing solder ball beneath of the chip
cap and chip resistor ? FYI our stencil thickness is 7 Mils
and majority happen on 1206 part size. Also the raw PCB it
self have mask with thickness around 1 Mils which defenetely
increase the solder paste thickness after printing. Any thing
we can do with decrease stencil thickness or stencil opening to
resolve this issue ?
Highly appreciate your advice .
****************************************************
Regards...
Marsal GM Tampubolon.
Senior Quality Engineer
CEI Contract Manufacturing, Singapore.
Batam Plant, Indonesia.
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