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Date: | Fri, 2 Feb 2007 18:11:47 +0800 |
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This will happen especially in high thermal plated-through holes. Higher preheat temperature, more active flux, press-fit pins, etc. will help to reduce the defect.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lin Leo
Sent: Friday, February 02, 2007 5:43 PM
To: [log in to unmask]
Subject: [TN] OSP surface finish for lead free wave slodering process
Hi,
Recently, we have a defect for through hole un-fill in lead free wave soldering process.
PCB board thickness: 94 mil
PCB surface finish: OSP(For high temperature type)
Wave soldering alloy material: Sn-Ag-Cu
Any through hole size have the same defect.
Does anyone understand how to overcome this defect or have related research for that?
Best regards
Leo
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Technet Mail List provided as a service by IPC using LISTSERV 1.8e
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Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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