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February 2007

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Tue, 20 Feb 2007 13:24:14 -0600
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text/plain (61 lines)
Ramon, I assume you need a thermally conductive and adhesive-backed pad
such as SilPad for the heatsinks. There are many out there, but you need
to specify what thermal conductivity you need, the temperature rating
(what temperatures it must be able to withstand during worst-case
operation), what you intend to adhere to (metal, composite, plastic, PA,
or W) and last but far from least, the CTE factor you require. You can't
just slap anything under those parts and see if they pass functional
test. Get a Bergquist catalog or go to their website at
http://www.bergquistcompany.com/index.cfm?CFID=743285&CFTOKEN=41282313.
They have all kinds of thermally conductive "gap fillers" which can be
anything from a thermal epoxy, an adhesive backed thermally conductive
pad, electrically conductive, or electrically insulative, or a
lithium-filled grease, etc. Many of these cure at room temperature in a
few minutes. A word of caution, try to stay away from the greases and
the silicone products. 
For the stiffeners, you may wish to look at Resiweld, Eccobond, Conap,
etc. Again you need to make sure that the CTE match is appropriate, or
the stiffeners can pop off, depending on the service environment the
product is used in. These can all cure while the board is being baked to
remove moisture.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
Sent: Tuesday, February 20, 2007 11:02 AM
To: [log in to unmask]
Subject: [TN] Preforms Adhesives

 

		

	Technetters:
	             Do you know of preform adhesives to bond stiffeners
or heatsinks to PWBs that do not require vacuum bags and bake, but only
bake in an oven with a proven track record?
	Regards,
	Ramon

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