Subject: | |
From: | |
Reply To: | |
Date: | Tue, 13 Feb 2007 10:28:33 EST |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hi Graham,
You are absolutely right, with the LF-solders, vapor phase soldering is the
way to go, because of
(1) assured uniform temperatures, everywhere, and
(2) soldering just above Liquidus is possible avoiding the much higher peak
reflow temperatures needed because of the thermal gradients resulting from all
other heat transfer modes.
Unfortunately, this technically very elegant way of reflowing solder got a
black eye in its earlt history, because oven manufacturers designed their oven
improperly in terms in insufficient pre-heating capability [resulting in solder
pooling up component leads] and insufficient sealing [resulting in expensive
vapor fluid losses].
Werner
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|