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February 2007

TGAsia@IPC.ORG

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Mon, 12 Feb 2007 04:10:25 -0600
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Asia Committe Task Group Forum <[log in to unmask]>, Charlotte Hao <[log in to unmask]>
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童老师:
 
真高兴!又看到你的身影了。
欢迎给我们多提意见。
 
TG2-34小组计划在3月20号左右在上海召开第二次T-50审核会议,盼望童老师、小组成员及各位同仁届时参加!
 
谢谢!
 
Charlotte  郝宇
Translator/Technical Resources Assistant
IPC WOFE, a subsidiary of IPC, Inc.
爱比西国际科技管理咨询(上海)有限公司
上海市宜山路711号
Tel: 021-54973435
Fax: 021-54973437 
邮编:200233
 

________________________________

From: TGAsia 代表 tongxm
Sent: 2007-2-12 (星期一) 16:43
To: [log in to unmask]
Subject: [TGA] 术语修改1部分


> 小段和小郝: 

很抱歉,由于工作脱不开身,不能及时校对。我将陆续发给你部分校对内容。(见下列内容1) 

--------- 

IPC-T-50G Part 1 of 12 

术语修改第1部分: 

Abrasive Trimming 磨蚀调整 54.1318 

Adjusting the value of a film component by notching it with a finely-adjusted stream of an abrasive material against the resistor surface. 

在电阻表面, 用微调研磨材料流量开槽的方法改变薄膜元件的值。 

▲ 磨蚀调阻---用(高速)研磨材料流在电阻器表面开槽的方法调整膜式元件的阻值。 

Accelerated Aging 加速老化 93.0001 

A test in which the parameters such as voltage and temperature are increased above normal operating values to obtain observable or measurable deterioration in a relatively short period of time. 

将参数如电压或温度增加到正常工作值之上, 在短期内就可以得到可见或可测量的变质的测试。 

◆试验时将诸如电压或温度等参数增加到正常工作值之上, 以在短期内获得可见或可测变质情况的测试。 

Accelerated Life Test 加速寿命测试 93.0119 

See "Accelerated Aging." 

见”加速老化”。 

Accelerated Test 加速测试 93.0216 

A test to check the life expectancy of an electronic component or electronic assembly in a short period of time by applying physically severe condition(s) to the unit under test. 

将受测单元置于严酷物理条件下,在短时期内检查电子元件或电子组装件预期寿命的测试。 

◆加速试验---通过对受测零件施加严酷物理条件,在短期内检查电子元器件或电子组装件预期寿命的试验。----------查元器件总规范 

Acceleration Factor (AF) 加速度因子 93.0260 

The ratio of stress in reliability testing to the normal operating condition. 

可靠性测试与正常操作条件下的应力之比。 

◆加速因子---可靠性试验与正常工作条件的应力之比。 

Acceptance Quality Level (AQL) 可接受质量限 90.0003 

The maximum number of defectives likely to exist within a population (lot) that can be considered to be contractually tolerable; normally associated with statistically derived sampling plans. 

一个总体中可能存在且合同所允许的最多缺陷数,通常与统计抽样方案有关。 

◆ 合格质量水平---一个总体(批)中可能存在且合同所允许的最多缺陷数,通常与源自统计的抽样方案有关。 

Acceptance Tests 92.0004 

验收试验 

Those tests deemed necessary to determine the acceptability of a product and as agreed to by both purchaser and vendor. 

经采购方和供应商同意,为确定产品可接受性所必须的测试 

◆按照采购方和供应方的协议,为确定产品的可接收性所必需要求的测试。 

Acceptance Inspection (Criteria) 接受检验(准则) 92.0288 

An inspection that determines conformance of a product to design specifications as the basis for acceptance. 

确定产品与验收依据??设计规范一致性的检测。 

◆ 验收检验(标准)---确定产品对作为验收根据的设计规范符合性的检验。 

Access Hole 余隙孔 60.1319 

A series of holes in successive layers of a multilayer board, each set having their centers on the same axis. These holes provide access to the surface of the land on one of the layers of the board. (See Figure A-1.) 

多层板逐连层中一系列孔,孔的中心在同一轴线上,这些孔为进入印制板某一层连接盘的表面提供了通道。(见图A-1) 

◆ 通导孔--- 多层板逐连层上的一系列孔,其每组孔的中心都在同一轴线上,这些孔为进入印制板某一层连接盘的表面提供了通道。(见图A-1) 

(原GB2036有误). 

Access Protocol 进入(许可)协议 21.0005 

An agreed principle for establishing how nodes in a network communicate electronically. 

建立网络结点如何实现电子通讯的约定规则。 

◆为在电子网络通信中建立何种结点而协商一致的原则。 

Accordion Contact “Z”形接触件 36.0006 

A type of connector contact that consists of a flat spring formed into a "Z" shape in order to permit high deflection without overstress. 

由扁平弹簧折成”Z”型所构成的连接器接触件,这种接触件允许高挠曲而无过度应力。 

◆ 由”Z”形扁平弹簧构成的一种连接器接触件,以允许高度变形而无过应力。 

Accuracy 精度 90.0007 

The deviation of the measured or observed value from the true value. 

测量值或观察值与真值间的偏差。 

◆测量值或观察值对真值的偏差。 

Acid Flux 酸性助焊剂 46.0009 

A solution of an acid and an inorganic, organic, or water soluble organic flux. (See also "Inorganic Flux," "Organic Flux," and "Water Soluble Organic Flux.") 

一种酸和无机,有机或水溶性有机助焊剂的溶液。 (参照“无机助焊剂”、 “有机助焊剂”和“水溶性有机助焊剂”) 

◆一种酸与无机助焊剂、有机助焊剂或水溶性有机助焊剂的溶液。 

Acid Number 酸号 54.0010 

The amount of potassium hydroxide in milligrams that is required to neutralize one gram of an acid medium. 

中和1克酸液所需氢氧化钾的毫克数。 

◆ 中和1克酸介质所需氢氧化钾的毫克数。 

Acid-Core Solder 酸芯焊料 46.0008 

Wire solder with a self-contained acid flux. 

有自给酸性助焊剂的焊线。 

◆自含酸性助焊剂的焊料丝。 

Actinic Radiation 有效光 52.0011 

Light energy that reacts with a photosensitive material in order to produce an image. 

与感光材料相互作用生成影像的光能量. 

◆光化辐射---与感光材料发生作用以达到显影/成像目的的光能。 

Active Desiccant 活性干燥剂 30.0397 

Desiccant that is either fresh (new) or has been baked according to the manufacturer's recommendations to renew desiccant to original specifications. 

未用过的(新的)或者根据制造商的建议翻新(还原)到原始规格的被烘干的干燥剂. 

◆ 未用过的(新的)或者根据制造商的建议烘干以重新去湿达到原始规格的干燥剂. 

Activated Rosin Flux 活性助焊剂 46.0012 

A mixture of rosin and small amounts of organic-halide or organic-acid activators. (See also "Synthetic Activated Flux.") 

松香和少量的有机卤化物或有机酸活化剂的混合物. (见”合成活性助焊剂.”) 

Activating 活化 53.0013 

A treatment that renders nonconductive material receptive to electroless deposition. 

使非导电材料易于接受化学沉积的处理方法。 

◆ 使非导电材料易于接受化学沉积的打底处理方法。 

Activating Layer 活化层 53.0014 

A layer of material that renders a nonconductive material receptive to electroless deposition. 

使非导电材料易于接受化学沉积的材料层。 

◆使非导电材料易于接受化学沉积的打底材料层。 

Activator 活化 46.0015 

A substance that improves the ability of a flux to remove surface oxides from the surfaces being joined. 

提高助焊剂从待焊接表面去除表面氧化物能力的物质。 

◆活化剂---(同) 

Active Device 主动器件 30.0016 

An electronic component whose basic character changes while operating on an applied signal. (This includes diodes, transistors, thyristors, and integrated circuits that are used for the rectification, amplification, switching, etc., of analog or digital circuits in either monolithic or hybrid form.) 

工作在给定信号下时,基本特性发生改变的电子元件。包括二极管、 晶体管、开关元件(可控硅)和用于整流、放大、 开关的集成电路等,单片或复合型的模拟或数字电路。) 

◆有源器件---在给定信号下工作时,基本特性发生变化的电子元器件。包括用于单片或混合电路中模拟或数字电路的二极管、 晶体管、半导体闸流管和整流、放大、 开关等的集成电路等。) 

Active Trimming 有源微调 54.1321 

Adjusting the value of a film circuit element in order to obtain a specified functional output from the circuit while it is electrically activated. 

调节薄膜电路元件的值使其在电触发时从电路中获得指定功能的输出 

▲ 功率微调---调节膜式电路元件的阻值,在工作状态下从电路中获得规定功能的输出。 

Add-On Component 扩充元件 30.0019 

Discrete or integrated packaged or chip components that are attached to a film circuit in order to complete the circuit's function. 

用于实现电路功能的附着在薄膜电路上的分立的或集成封装的或片式的元件。 

▲贴装元件---为了实现电路功能而贴装在膜式电路上的分立、集成封装或片式元件。 

Adhesion (Pressure Sensitive Tape) 附着力(压力敏感胶带) 46.2038 

The bond produced by contact between pressure-sensitive adhesive and a surface. 

压力敏感胶带与表面接触所产生的粘接力. 

◆附着力(压敏胶带)--- 压敏粘合剂与一个表面之间通过接触而产生的粘接力. 

Adhesion Failure 粘接失效 96.0020 

The rupture of an adhesive bond such that the separation appears to be at the adhesive-adherend interface. 

粘结连接断裂, 如呈现在粘合剂附着界面处的分离。 

◆粘结连接断裂, 如呈现在粘合剂与被胶粘体界面处的分离。 

Adhesion Layer 粘结层 74.0021 

The metal layer that adheres a barrier metal to a metal land on the surface of an integrated circuit. 

隔离金属到集成电路表面焊盘间的粘接金属层. 

◆将势垒金属粘附到集成电路表面金属焊盘上的金属层. 

Adhesion Promotion 附着力增强 53.0022 

The chemical process of preparing a surface to enhance its ability to be bonded to another surface or to accept an overplate. 

预处理物体表面以增强其与其他表面的粘接能力或接受外加电镀层能力的化学工艺。 

◆粘合力增强处理--- 一种表面化学处理工艺,以提高该表面与另一表面的粘合能力,或增强接受外镀层的能力。 

Adhesive Coated Substrate 涂胶基板 41.0438 

A base material upon which an adhesive coating is applied, for the purpose of retaining the conductive material (either additively applied or attached as foil for subtractive processing), that becomes part of a metal-clad dielectric. 

用于保留导电材料,其表面涂敷有粘合剂涂层的基材(即可另外涂敷,也可连接减工艺的铜箔),从而成为覆金属箔绝缘部分。 

◆涂胶基板---为了粘合导电材料(当减成加工时,既可另外附金属箔,也可已附上了金属箔),其表面涂覆有粘合剂涂层的基材,从而成为覆金属箔绝缘体的一部分。 

Adhesive-Coated Catalyzed Laminate 涂胶催化层压板 41.1320 

A base material with a thin polymer coating, that contains a plating catalyst, that is subsequently treated in order to obtain a microporous surface. 

一种涂覆了薄聚合物涂层的基材,其含有电镀催化剂,在其后续处理中可获得微孔结构的表面。 

◆一种涂覆了薄聚合物涂层的基材,其涂层含有电镀催化剂,在后续处理中可获得多微孔结构的表面。 

Adhesive-Coated Uncatalyzed Laminate 涂胶非催化层压板 41.1323 

A base material with a thin polymer coating, that does not contain a plating catalyst, that is subsequently treated in order to obtain a microporous surface. 

一种涂覆了薄聚合物涂层的基材,未含电镀催化剂,在其后续处理中可获得多微孔结构的表面。 

◆一种涂覆了薄聚合物涂层的基材,其涂层未含电镀催化剂,在其后续处理中可获得多微孔结构的表面。 

Adhesive Transfer (Pressure Sensitive Tape) 粘合剂转移(压敏胶带) 75.0558 

The transfer of adhesive from its normal position on the pressure sensitive tape to the surface to which the tape was attached, either during unwind or removal. 

当压力敏感胶带上从贴附表面揭开或移除时, 粘合剂从正常位置转移到胶带所粘附的表面。 

◆粘合剂转移(压敏胶带)---当揭开或移动压敏胶带时, 其上的粘合剂从正常位置到胶带所粘附表面的转移。 

Adsorbed Contaminant 吸附污染物 96.0023 

A contaminant attracted to the surface of a material that is held captive in the form of a gas, vapor or condensate. 

以气体、蒸汽或冷凝液的形式粘附在材料表面的污染物。 

◆以气体、蒸汽或冷凝液的形式被俘获而粘附在材料表面的污染物。 

Advanced Statistical Method 高级统计法 91.0024 

A statistical process analysis and control technique that is more sophisticated and less widely-applicable than basic statistical methods. 

与基本统计法相比, 更加复杂及应用范围较小的统计过程分级及控制技术 

◆ 与基本统计法相比, 更加精密复杂及较窄应用范围的统计过程分析及控制技术。 

Air Pollution 空气污染 14.0027 

Contamination of the atmosphere with substances that are toxic or otherwise harmful. 

大气被有毒或其它有害物质污染。 

◆大气具有有毒或其它有害物质的污染。 

Alignment Mark 对准标记 22.0030 

A stylized pattern that is selectively positioned on a substrate material to assist in alignment. (See Figure A-2.) 

为帮助对准定位,有选择地设置在基材上的特定图形。 

◆ 为帮助对准定位,选择性地设置在基材上的符合特定程式的图形。 

Aliphatic Solvents 脂肪族溶剂 76.0031 

"Straight chain" solvents, derived from petroleum, of low solvent power. 

,从石油中提取的“直链”溶剂,其溶解能力较低。 

Aliphatic Solvent 脂肪族溶剂 

有机化合物大体上可分为以直连碳炼所组成的脂肪族,与含苯环状的芳香族(Aromatic)。某些直炼状分子的有机溶剂,如乙醇、丙酮、丁酮(MEK)、三氯乙烷等皆称为"脂肪族溶剂"。 

Allowable Temperature 容许温度 75.0609 

The temperature range that an electronic circuit or component can perform its intended functions. 

电子电路或元器件能实现其预期功能的温度范围。 

Alloy, Tin Bismuth (Sn-Bi) 锡铋合金(Sn-Bi) 45.1947 

An alloy that is used as a lead free solder and consisting of tin and bismuth as the main constituents. Sn-Bi58 has a low melting point of 138 C [280 F], but is not widely used because of its brittle properties. 

以锡及铋为主要成分制作的无铅焊料合金,锡铋58具有138℃ [280?]的低熔点, 但由于其脆性而未被广泛应用. 

Alloy, Tin Copper (Sn-Cu) 锡铜合金(Sn-Cu) 45.1948 

An alloy that is used as a lead free solder consisting of tin and copper considered to be applicable for wave or reflow soldering. 

由锡及铜为主要成分制作的无铅焊料合金,主要可应用于波峰焊及再流焊。 

Alloy, Tin Silver(Sn-Ag) 锡银合金(Sn-Ag) 45.1949 

An alloy that is used as a lead free solder and consisting of tin and silver as the main constituents used as a high temperature solder. 

由锡及银为主要成分制作的无铅焊料合金,主要用作高温焊料。 

Alloy, Tin Silver Bismuth (Sn-Ag-Bi) 锡银铋合金(Sn-Ag-Bi) 45.1950 

An alloy that is used as a lead free solder and consisting of tin, silver and bismuth as the main constituents. The Bi in Sn-Ag-Bi alloy reduces the melting temperature. The higher the Bi content is, higher the mechanical strength, but with poorer elongation capability. There is a limit to Bi content. 

以锡, 银, 铋为主要成分制作的无铅焊料合金。铋在锡银铋合金中可降低熔融温度。 铋的含量越高,机械强度越高,但拉伸性能越差, 所以应限制铋的含量。 

Alloy, Tin Silver Copper 锡银铜合金(Sn-Ag-Cu) 45.1951 

An alloy that is used as a lead free solder consisting of tin, silver and copper as the main constituents. 

以锡,银,铜为主要成分制作的无铅焊料合金。 

Alloy, Tin Zinc 锡锌合金(Sn-Zn) 45.1952 

An alloy that is used as a lead free solder and consisting of tin and zinc as the main constituents. Zn09 alloy has the melting point of 199 C [390 F], closest to the melting point of Sn-Pb alloy among lead free solders, which allows soldering work at present soldering temperatures, but tends to form a stable oxide film, causing difficulty in securing a good solder wetting. 

以锡, 锌为主要成分用作无铅焊料的合金. 在无铅焊料之中,锌09合金具有199摄氏度[399华氏度]的熔点, 与锡钱合金的熔点接近, 可用目前的焊接温度进行焊接, 但是因为易于形成坚固的氧化膜, 所以难以形成良好的焊料浸润. 

◆ 以锡, 锌为主要成分制作的无铅焊料合金。锌09合金具有199 ℃[399?]的熔点, 与锡铅合金的熔点接近, 可用目前的焊接温度进行焊接。但因易于形成稳定的氧化膜, 所以难以形成良好的焊料润湿。 

Alpha Error Alpha错误 91.0033 

The size of a Type I error or the probability of rejecting a hypothesis that is true. 

I型错误,以原假设为真而被拒绝的概率。 

Alphanumerical 文字, 数字的 25.1729 

Pertaining to data that contain the letters of an alphabet, the decimal digits, and may contain control characters, special characters and the space character. 

关于包含字母、 十进制数字的数据, 也可以包括控制字符、 特殊字符及空格字符。 

◆字符---(同) 

Alpha Particle Alpha粒子 35.0612 

A He 4 nucleus generated from a nuclear decay that is capable of generating hole-electron pairs in microelectronic devices and switching cells causing soft errors in some devices. 

能够在微电子器件和开关单元中生成电子空穴对,从核衰变中产生的的氦原子核,会引发某些器件内的软错误。 

Alternating Current (ac) 交流(ac) 21.1793 

A current that varies with time, commonly applied to a power source that switches polarity many times per second, in the shape of a sinusoidal, square, or triangular wave. 

随时间而变的电流,通常用于每秒多次极性转换的正弦, 方波或三角波电源。 

◆交流电(a.c.)--- 随时间而变的电流,通常以每秒多次极性转换的正弦, 方波或三角波施加影响于电源。 

Amorphous Polymer 无定形聚合物 40.0035 

A polymer with a random and unstructured molecular configuration. 

分子结构为无规则的、非结构性的聚合物。 

▲分子构型为无规则、无明确结构的聚合物。 

Amplitude, Voltage 幅值, 电压 21.0036 

The magnitude of a voltage as measured with respect to a reference, such as a ground plane. 

参照基准, 如接地层所测得的电压值。 

▲ 相对于基准测得的电压值,如相对接地面的测量值。

 
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