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Thx Mrs. Tong. We will do our efforts to finish the draft version.
Best regards,
Duan Shi Hao (Andy)
------------------------------------------------------------------------
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-----Original Message-----
From: TGAsia [mailto:[log in to unmask]] On Behalf Of tongxm
Sent: Wednesday, February 28, 2007 11:07 AM
To: [log in to unmask]
Subject: [TGA]
小郝小段：修改的部分术语见下：
IPC-T-50G Part 1 of 12
术语修改5部分
Backplane 背板 85.1331
An interconnection device used to provide point-to-point electrical interconnections. (It is usually a printed board that has discrete wiring terminals on one side and connector receptacles on the other side.) (See also "Mother Board.")
用于实现点对点电气互连的互连设备.(通常是一面带有分立接线端子， 另一面带有连接插座的印制板。)（又见“母板”。）
Backup Pin 支撑销 70.0972
A supporting pin that is located under a printed board to prevent deflection of the board during component mounting.
位于印制板下防止板在元件贴装过程中发生偏移的支承销钉。
Bake Out 烘干 56.0082
Subjecting a product to an elevated temperature in order to remove moisture and unwanted gasses prior to certain steps in the printed board manufacturing process or prior to final coating.
在印制板制作工艺某一步骤或最终涂覆前，使产品经受高温以去除湿气及不需要气体。
Ball 焊球 34.0976
A raised metal, (or other conductive material) feature on a package substrate used to facilitate bonding to the next level of interconnect.
为便于与下一级互连连接而置于封装基板上的凸起金属(或其他导通材料)。
▲封装基板上的凸起金属(或其他导通材料)特征，常用于进行下一级互连。
Ball Array 球阵列 34.1086
A group of balls arranged in rows and columns.
成行及成列排列的一组球。
Ball Bond 球焊 74.0083
The welded connection of a bond wire to the bond pad of an integrated circuit die. The bond wire is melted to form a ball and the ball is bonded by use of thermocompression or thermosonic techniques.
键合引线至集成电路晶片上键合焊盘的焊接连接。 键合引线融化成为焊球，再应用热压焊及热超声波压焊技术键接焊球。
▲键合线对集成电路裸芯片上键合焊盘的焊接连接。 键合线融化形成焊球，再应用热压焊及热超声波技术键合焊球。
Ball Grid Array (BGA) 球栅阵列 34.1096
A surface mount package wherein the bumps for terminations are formed in a grid on the bottom of a package. (See Figure B-3.)
引出端凸起以栅格形式排列于封装底部的表面贴装封装。
Ball Lift 焊球起翘 74.2127
A category of ball bond failure in which the ball lifts from the surface of the integrated circuit die bond pad metallization or lifts the metallization from the surface of the underlying oxide or silicon.
一种焊球键合的失效，焊球从集成电路晶片键合焊金属化层起翘或金属化层从氧化基层或硅片上起翘。
▲ 一种焊球键合失效情况。即焊球从集成电路芯片键合盘金属化层表面起翘，或金属化层从下面的氧化层或硅片上起翘。
Bar 条 70.1238
The dark element of a bar code.
条形码上的黑色要素元素。
Bar Code 条形码 70.1292
A linear arrangement of bars and spaces in a predetermined pattern.
以预先确定的样式，呈直线型排列的条和间隔。
▲线条和间隔以预先确定的图案呈直线排列。
童晓明CESI
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