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February 2007

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Wed, 7 Feb 2007 08:44:49 -0500
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TechNet E-Mail Forum <[log in to unmask]>, Robert Coburn <[log in to unmask]>
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Robert Coburn <[log in to unmask]>
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Hi T'netters;
My emails can't get through using my work address so hopefully this 
alternate e-dress works.

My questions are:
Does anyone pre-treat pure tin finish terminations on components with a hot 
solder dip to mitigate tin whiskers?
Is there an industry standard on this process?

TIA;

Regards,
Rob Coburn
TDI
[log in to unmask]

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