LF residue reactivity can range from weak to stronger than OA,
especially if not fully activated. Oven reflow of no-clean solder paste
usually ensures full activation resulting in inert residues, but not
always. Hand soldering of benchtop liquid no-clean fluxes such as for
rework or touchup pretty much guarantees some amount of unactivated flux
residue remains behind.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
Sent: Tuesday, January 09, 2007 11:18 AM
To: [log in to unmask]
Subject: Re: [TN] Cleaning

So Bev,

LF residues really are more reactive? You seem to have done some
measurements.

Thanks,

Ioan

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Bev Christian
Sent: Tuesday, January 09, 2007 12:12 PM
To: [log in to unmask]
Subject: Re: [TN] Cleaning


John,
Not if they do their homework and do the proper testing to show that the
tweak in reactivity won't put them on dangerous ground.  That is why
there are tests like copper mirror, halide ion, British corrosion test,
SIR and electrochemical migration.
Bev
RIM

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: January 9, 2007 12:02 PM
To: [log in to unmask]
Subject: Re: [TN] Cleaning

That's what I was thinking Brian...................8-)

With the change to lead free and the various "wetting" issues a lot of
people are using a more active flux if only to make the joints "look"
more
like 63/37 and as a result are having to use cleaning systems to remove
the flux.

Of course the ones that do not remove the flux will find out eventually
why they should have done!!

John

 
 
John Burke
 
(408) 515 4992

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