Werner,

 

Cheers, you've confirmed my initial thought's!.....time for some debate!

 

Regards,

    Iain.



-----Original Message-----

From: [log in to unmask] [mailto:[log in to unmask]]

Sent: 09 January 2007 17:42

To: Braddock, Iain; [log in to unmask]

Subject: Re: [TN] Component qualification!





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Hi Iain,

You are correct—no 'carte blanche' capability can be assumed given the limits we are pushing.

And it is not just "the difference in peak processing temperatures/component temperature limitations," but also moisture content and multiple solder temperature excursions that come into the picture.



Werner







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