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January 2007

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Subject:
Re: Component qualification!
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 9 Jan 2007 12:42:25 EST
Content-Type:
text/plain
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text/plain (19 lines) 
Hi Iain,
You are correct—no 'carte blanche' capability can be assumed given the limits 
we are pushing.
And it is not just "the difference in peak processing temperatures/component 
temperature limitations," but also moisture content and multiple solder 
temperature excursions that come into the picture.

Werner

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