Werner,
 
I forgot to mention I was talking about lead-free. 
 
I take it you mean with the difference in peak processing temperatures / component temperature limitations? 
 
My concern is that even if you were to test / qualify certain component families with both VP & CR and prove no problem, it wouldn't provide 'carte blanche' capability, ie. you would only need to carry out VP qualification for future components.
 
Regards,
    Iain.

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: 08 January 2007 18:34
To: Braddock, Iain; [log in to unmask]
Subject: Re: [TN] Component qualification!


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Hi Iain,
For SnPb-assembly the differences may not be significant, but as you move into the LF-soldering arena, the difference between vapor phase vs. N2-convection become more critical.



Werner




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