TECHNET Archives

January 2007

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Reliability 6012 Cl2 vs. Cl3
From:
Jay Otts <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jay Otts <[log in to unmask]>
Date:
Sat, 6 Jan 2007 14:23:57 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (28 lines) 
Need help in quantifying difference in reliability prediction for a specific board 
design meeting 6012 Class 2 vs. Class 3 requirements, given all parameters 
equal except internal annular rings.  My concern is breakout allowed by class 2 
vs. 1 mil min. internal annular ring per class 3.

Parameters:

high quality FR4 material
15" x 15" size
20 layer high density
layers 1 -5 contain blind vias
finished board thickness appx. 0.110"
1mm dot pitch bga's 
benign operating environment

Jay Otts
Raytheon

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2