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January 2007

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 31 Jan 2007 19:56:58 EST
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In a message dated 1/31/07 14:12:11, [log in to unmask] writes:

> We are looking for the IPC spec that calls out the maximum Au plating
> thickness on leads in order to prevent Au embrittlement.
> 
> Hi Karen,
No such thing.
Reason, Au-embrittlement depends on too many variables. A 4 wt.% Au of 
uniform distribution is the VERY APPROXIMATE 'red flag' threshold. If you have 
non-uiform distribution—the more likely scenario-- lower Au % can lead to 
Au-embrittlement.


Werner

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