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January 2007

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Subject:
From:
Karen Ebner <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Karen Ebner <[log in to unmask]>
Date:
Wed, 31 Jan 2007 16:16:07 -0500
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Hi All

Thank you for your responses.  This has been very helpful.

Thanks again!




"Sauer, Steve (Xetron)" <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
01/31/2007 03:53 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
"Sauer, Steve (Xetron)" <[log in to unmask]>


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Subject
Re: [TN] Maximum Au lead plating thickness






 Steve,
I know, long time no hear, too busy keeping the bears off my arse!

The standard states that "the gold shall be removed from 95% of all
surfaces of surface mount components to be soldered regardless of
thickness."
BUT in the same paragraph (3.9.3 of rev D) the following is stated
"These requirements may be eliminated if there is documented objective
evidence available for review that there are no gold related solder
embrittlement problems associated with the soldering process being
used."
So, the objective evidence would be the calculated percentage of gold in
the solder connection.
A sticky situation to be agreed upon with the customer.

Steve

Steve Sauer, CEPM
Sr. Manufacturing Engineer
Northrop Grumman Xetron
Cincinnati, OH
513-881-3368
[log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Wednesday, January 31, 2007 3:34 PM
To: [log in to unmask]
Subject: Re: [TN] Maximum Au lead plating thickness

Doesn't J-STD-001 say that you can't solder to SMT components with gold
plating no matter what the thickness, and to PTH components unless the
plating is less than 2.5 micro-meters without removing the gold?

-Steve Gregory- 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Louis, Edwin @ CSE
Sent: Wednesday, January 31, 2007 2:26 PM
To: [log in to unmask]
Subject: Re: [TN] Maximum Au lead plating thickness

Ron Bulwith at Alpha Metals(Cookson in Jersey City) researched this and
found that allowable Gold thickness you can solder to with a Tin solder
is ~15-20 micro-inches.You can solder to Gold up to ~200 micro-inches
thick with Lead-Indium solder.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Wednesday, January 31, 2007 2:32 PM
To: [log in to unmask]
Subject: Re: [TN] Maximum Au lead plating thickness

Karen,
You won't find it because it does not exist.  You want less than 4% by
weight in the final joint for sure.  Dr. Cotts of SUNY Binghampton would
argue for much less.

The reason you won't find a lead plating limit is that the results will
depend on:
1) lead size
2) pad size
3) stencil thickness

These will all affect the final joint concentration.

Bev
RIM

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Karen Walters Ebner
Sent: Wednesday, January 31, 2007 2:01 PM
To: [log in to unmask]
Subject: [TN] Maximum Au lead plating thickness

Hi 

We are looking for the IPC spec that calls out the maximum Au plating
thickness on leads in order to prevent Au embrittlement.

Can anyone provide this to me.

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