Correct once again, Steve. Per par. 3.9.3 of Rev D, you must either
remove the gold ON COMPONENT LEADS via tinning or you must perform
qualification testing and present it for approval to prove a gold
embrittlement issue does not exist with "documented objective evidence".
That is a time-variable qualification. You cannot just hang a 5-lb
weight on a wire and solder the other end to the component lead and say
"it didn't break, so it must be OK".
ENIG finishes on circuit boards or substrates are exempt from this.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Wednesday, January 31, 2007 2:34 PM
To: [log in to unmask]
Subject: Re: [TN] Maximum Au lead plating thickness
Doesn't J-STD-001 say that you can't solder to SMT components with gold
plating no matter what the thickness, and to PTH components unless the
plating is less than 2.5 micro-meters without removing the gold?
-Steve Gregory-
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Louis, Edwin @ CSE
Sent: Wednesday, January 31, 2007 2:26 PM
To: [log in to unmask]
Subject: Re: [TN] Maximum Au lead plating thickness
Ron Bulwith at Alpha Metals(Cookson in Jersey City) researched this and
found that allowable Gold thickness you can solder to with a Tin solder
is ~15-20 micro-inches.You can solder to Gold up to ~200 micro-inches
thick with Lead-Indium solder.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Wednesday, January 31, 2007 2:32 PM
To: [log in to unmask]
Subject: Re: [TN] Maximum Au lead plating thickness
Karen,
You won't find it because it does not exist. You want less than 4% by
weight in the final joint for sure. Dr. Cotts of SUNY Binghampton would
argue for much less.
The reason you won't find a lead plating limit is that the results will
depend on:
1) lead size
2) pad size
3) stencil thickness
These will all affect the final joint concentration.
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Karen Walters Ebner
Sent: Wednesday, January 31, 2007 2:01 PM
To: [log in to unmask]
Subject: [TN] Maximum Au lead plating thickness
Hi
We are looking for the IPC spec that calls out the maximum Au plating
thickness on leads in order to prevent Au embrittlement.
Can anyone provide this to me.
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