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January 2007

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Wed, 31 Jan 2007 14:33:19 -0600
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text/plain (117 lines)
Of course you can solder to it. That is not the question. 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Louis, Edwin @ CSE
Sent: Wednesday, January 31, 2007 2:26 PM
To: [log in to unmask]
Subject: Re: [TN] Maximum Au lead plating thickness

Ron Bulwith at Alpha Metals(Cookson in Jersey City) researched this and
found that allowable Gold thickness you can solder to with a Tin solder
is ~15-20 micro-inches.You can solder to Gold up to ~200 micro-inches
thick with Lead-Indium solder.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Wednesday, January 31, 2007 2:32 PM
To: [log in to unmask]
Subject: Re: [TN] Maximum Au lead plating thickness

Karen,
You won't find it because it does not exist.  You want less than 4% by
weight in the final joint for sure.  Dr. Cotts of SUNY Binghampton would
argue for much less.

The reason you won't find a lead plating limit is that the results will
depend on:
1) lead size
2) pad size
3) stencil thickness

These will all affect the final joint concentration.

Bev
RIM

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Karen Walters Ebner
Sent: Wednesday, January 31, 2007 2:01 PM
To: [log in to unmask]
Subject: [TN] Maximum Au lead plating thickness

Hi 

We are looking for the IPC spec that calls out the maximum Au plating
thickness on leads in order to prevent Au embrittlement.

Can anyone provide this to me.

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