IPC/Soldertec Global Conference on Lead Free Reliability
28 February 2007
San Sebastian, Spain

The RoHS directive has been in place for over 6 months now. New
questions have begun to arise for circuit boards in areas like poor
wetting, solderability on different surface treatments, heat resistance
at FR4 base material, lead contamination and reliability. The demand for
advice and solutions is increasing dramatically.

To give the European electronic industry some answers to the problems
caused by implementing lead free processes, IPC and Soldertec Global, in
cooperation with the EU projects and organizations ELFNET, GREENROSE,
and LEADOUT, will hold an International Lead Free Reliability Conference
in San Sebastian, Spain. The one-day Reliability Conference will be held
with the ELFNET Dissemination Event.

For more information or to register for this conference, please cut and
paste
http://www.ipc.org/calendar/2007/LFReliab_Soldertec_2.07/LFSebastian_Con
f207.htm into your browser.

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