The IPC-D-325 has not been revised in several years and it"s replacement
is current in work. To be in accordance with current specifications, all
that is necessary, in addition to the type of mask you wish to use and
the sides to apply it to, is to specify that the mask meet IPC-SM-840,
Type T or H. If you wish a specific mask thickness, then specify it as
well. Only class 3 of IPC-6012 specifies a minimum soldermask thickness.
Regards,
Gary Ferrari
FTG Circuits
Director, Technical Support
860-350-9300
Andrew Clifford wrote:
> I am currently working on the notes section of a new PCB design and was
> pointed towards the examples section in IP-D-325A for some suggested notes
> on the choice of soldermask. The note I have been asked to use is:
>
> "Construction to be SMOBD, using liquid photoimageable (LPI) solder mask
> material, type XXXX. Apply to both external layers in accordance with IPC,
> (Type B, Class 2). Use appropriate solder mask artworks for each side of
> board."
>
> I am aware that "Type B, Class 2" has now become Type H (well, Class 3, but
> that is what we are using), but my question is this:
>
> What is the "Type XXXX"? I haven't been able to find much information at all
> in my searches. I found a series of posts on here from 1998, in which types B1
> and B2 are mentionned, but a source for these was never disclosed.
>
> If these are the types in question, I would be very grateful if someone could
> let me know the source of them, as my quality control guys will insist on a
> source if i put it down!!!
>
> Thanks very much for any help you can offer.
>
> Andrew Clifford
> Systems Engineer
> BAE Systems
> Plymouth, UK
>
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