TECHNET Archives

January 2007

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Bill Dworak <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bill Dworak <[log in to unmask]>
Date:
Thu, 25 Jan 2007 12:01:23 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (38 lines)
I am in need of some help with regards to assemble. I am a PCB manufacture and have built a group of boards for one of my accounts and they are having issues assembling and have asked me for help on the issues they are having.  
 The product is 4 layer board power and ground planes with 2 OZ copper inner layers the outer layers are 5 OZ copper. What is happening is that because of the construction of the board it is acting like a big heat sink and this is where the problems are coming from. These are old through hole designs they are assembling them by hand they are heating the irons way up causing surface issues on the boards and in some cases lifting of pads is resulting when extreme heat is applied they are heating them up a lot because of all the copper and as I am being told the solder is not melting the way that it should. 
 Any suggestions to make this a smooth build ? 
 Thank you. 

Bill Dworak













This email is intended solely for use by the individual to which it is addressed and may contain information
that is privileged and/or exempt from disclosure under applicable law. It may also contain data subject to
the International Traffic in Arms Regulations or Export Administration Regulations and cannot be
distributed or copied to foreign nationals, residing in the US or abroad without prior approval of the US
Department of State or appropriate export licensing authority. If the reader is not the intended recipient
you are hereby notified that any distribution or copying of this communication is strictly prohibited. If you
have received this communication in error, please notify the sender by email or collect call
and delete or destroy all copies of this email and/or any files attachments.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2