Jackson,
That is the first presentation I asked you about
Vladimir
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tina Nerad
Sent: Friday, December 22, 2006 10:23 AM
To: [log in to unmask]
Subject: [TN] IPC "Solder Joint Microvoiding: How Reliable is Your
Information?" webcast in January 2007
Save the Date!
January 25, 2007- 10:00 am - 11:00 am (CT), 11:00 am - 12:00 pm (ET)
Solder Joint Microvoiding: How Reliable is Your Information?
Presented by:
Don Cullen, Director of OEM and Assembly Applications, MacDermid, Inc.
John Swanson, Director of Final Finishes and Interconnects, MacDermid,
Inc.
Microvoids have become one of the most widely discussed PCB topics of
the post-RoHS world. Solder joint microvoiding emerged as a serious
reliability threat during a time of drastic changes in electronics
manufacturing: the lead free transition, use of high-stress BGA
attachment, and deployment of new PCB surface finishes. Over the past
three years, the topic has developed into a critical area of interest.
Today, there exists an in-depth understanding of the phenomenon, with
clear detection techniques, and implemented methods for prevention.
Catch up with the latest knowledge on this fascinating, yet troubling
failure mode.
The IPC will provide a 45 minute presentation from some of the insiders
on microvoid investigations, followed by at least 15 minutes of a Q&A
forum.
For registration information, please cut and paste the following into
your browser:
http://www.ipc.org/calendar/2007/SolderJoint_Microvoiding_01_29_07/Solde
rjoint_Webcast_01_29_07.htm
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ext.2815
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Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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