I remember reading here that you need at least 100 uin thickness of HASL
to adequately protect the copper pads.  A fabricator is asking to allow
40uin minimum.  If the boards are assembled within a couple days after
being received what minimum thickness would be adequate.  Would the
result of too little HASL show up immediately at assembly with dewetting
of the solder joints or could it show up later as cracked or broken
solder joints?    I am assuming both.

 

Jim Verrette

Electrical Engineer

 

 

 


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