Solder Joint Microvoiding: How Reliable is Your Information?

January 25, 2007 - 10:00 am - 11:00 am (CT), 11:00 am - 12:00 pm (ET)

Microvoids have become one of the most widely discussed PCB topics of
the post-RoHS world. Solder joint microvoiding emerged as a serious
reliability threat during a time of drastic change in electronics
manufacturing: the lead free transition, use of high-stress BGA
attachment, and deployment of new PCB surface finishes. Over the past
three years, the topic has developed into a critical area of interest. 

Presented by:
Don Cullen, Director of OEM and Assembly Applications, MacDermid, Inc. 
John Swanson, Director of Final Finishes and Interconnects, MacDermid,
Inc. 
To register for this webcast, please cut and paste
www.ipc.org/solderjointwc07 into your browser.
 

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