Thank you again.

Best regards
Tom 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Friday, January 19, 2007 2:22 PM
To: [log in to unmask]
Subject: Re: [TN] Minimum solder reflow temperatures for ENIG board
finish

Hi Richard &Tom,
The article you are referring to: "Soldering: Quality and Reliability
Issues" 
was published in global SMT & Packaging Vol. 1, No. 2, August 2001. You
may also be interested in the column "The Case Against ENIG," Global SMT
& Packaging, Vol. 5, No. 6, June/July 2005 [EU-edition].

Werner

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