Thank you again, Werner!
 

________________________________

From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: Friday, January 19, 2007 1:22 PM
To: Stadem, Richard D.; [log in to unmask]; [log in to unmask]
Cc: [log in to unmask]
Subject: Re: [TN] Minimum solder reflow temperatures for ENIG board
finish


Hi Richard &Tom,
The article you are referring to: "Soldering: Quality and Reliability
Issues" was published in global SMT & Packaging Vol. 1, No. 2, August
2001. You may also be interested in the column "The Case Against ENIG,"
Global SMT & Packaging, Vol. 5, No. 6, June/July 2005 [EU-edition].

Werner


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------