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January 2007

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Subject:
From:
"Gervascio, Thomas" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gervascio, Thomas
Date:
Fri, 19 Jan 2007 09:05:17 -0500
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One rule of thumb that I used over the years was when soldering eutectic
solder (Sn 63 Pb 37) on ENIG board finishes to run the profile a bit
hotter than HASL. Instead of say 205 C I remember literature citing 217
C as the minimium temperature with the rationale being that nickel
diffusion rates into solder are much slower than copper. 
 
I did several internet searches for some supporting literature and
couldn't readily find any. Any ideas where I could find some supporting
evidence and/or literature?
 
Thanks
Tom Gervascio

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