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January 2007

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Subject:
From:
Reuven Rokah <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Reuven Rokah <[log in to unmask]>
Date:
Thu, 18 Jan 2007 15:27:00 +0200
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Hi Bev,

You are refer only to components.
The PCBs also can be delaminated during BGA rework and should be dried. 

Best Regards
Reuven ROKAH 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Thursday, January 18, 2007 3:23 PM
To: [log in to unmask]
Subject: [TN] Rework of circuit packs with MSL Parts

Technetters,
We have required that circuit packs that are going to be reworked to be
dried before rework.  My questions to all of you are:
1) Do you require this for all your boards irrespective of what is on
them?
2) Do you dry it to the requirements of the most sensitive MSL
component?
3) Do you use thermocouples to see how hot the MSL components are going
to get from radiated, convected and transmitted heat?
40 If the latter, what is the maximum temperature you allow the nearest
MSL component to reach before you require a pre-dry?

Thanks in advance.

Bev
RIM



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