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January 2007

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Subject:
Re: Heat sensitive components
From:
"Macko, Joe @ IEC" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Macko, Joe @ IEC
Date:
Wed, 17 Jan 2007 06:41:38 -0800
Content-Type:
text/plain
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text/plain (61 lines) 
Good morning Dominic.

As a minimum, I would determine the manufacturer's peak body of solder
temperatures for the moisture sensitive components and then go after all
ICs.

Best Regards,
- Joe

-----Original Message-----
From: Dominic Boudreau [mailto:[log in to unmask]] 
Sent: Tuesday, January 16, 2007 10:58 AM
To: [log in to unmask]
Subject: [TN] Heat sensitive components

Hello Techneters, 

 

I have a question for you. Which are the heat sensitive SMT components
that are at risk for reflow oven temperatures?  In other words, which
components' reflow profiles should be verified prior to reflow
soldering.

 

Thank you

 

Dominic 

 

 


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