Heavy ceramic BGA's
Heavy CCGA's
Large (240pin) QFP's with an exposed heat slug
The main concern is that the package body tends to sink the local heat
around the solderjoint so the profile on the solder joint will run
cooler than you intend.

SMT components that can run too hot:
Most optical devices such as LED's, optical switches, fiber optic I/O's,
imagining chips, etc.
Film capacitors
Aluminum Electrolytic (Can) capacitors

To name a few...


-Ryan

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dominic Boudreau
Sent: Tuesday, January 16, 2007 11:58 AM
To: [log in to unmask]
Subject: [TN] Heat sensitive components

Hello Techneters, 

 

I have a question for you. Which are the heat sensitive SMT components
that are at risk for reflow oven temperatures?  In other words, which
components' reflow profiles should be verified prior to reflow
soldering.

 

Thank you

 

Dominic 

 

 


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