Start by looking at components with a Moisture Sensitivity Level of 3 or
higher as assigned by J-STD-020 and verify they are handled and stored
per J-STD-033B. I assume you keep track of MSD's somewhere in your
company MRP system?
I would focus first on the printed wiring boards by material type, size,
layer count, and protective packaging and come up with a system to
prevent them from being damaged first, then move to the components. 
Purchase the paper from Werner Englemaier regarding fabricated PWB
specifications and rating systems to ensure you get quality circuit
boards, then review the MSD levels of the components you use and ensure
your material handling processes are adequately keeping them dry up
through reflow (don't forget rework), and then for the ones that are
level 5, 5a, and 6 I would also review the reflow and rework profiles to
make sure they are appropriate. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dominic Boudreau
Sent: Tuesday, January 16, 2007 12:58 PM
To: [log in to unmask]
Subject: [TN] Heat sensitive components

Hello Techneters, 

 

I have a question for you. Which are the heat sensitive SMT components
that are at risk for reflow oven temperatures?  In other words, which
components' reflow profiles should be verified prior to reflow
soldering.

 

Thank you

 

Dominic 

 

 


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