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January 2007

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Subject:
Heat sensitive components
From:
Dominic Boudreau <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dominic Boudreau <[log in to unmask]>
Date:
Tue, 16 Jan 2007 13:57:38 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (32 lines) 
Hello Techneters, 

 

I have a question for you. Which are the heat sensitive SMT components
that are at risk for reflow oven temperatures?  In other words, which
components' reflow profiles should be verified prior to reflow
soldering.

 

Thank you

 

Dominic 

 

 


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