I agree with Werner and in the short term try reducing the stencil 
apertures to reduce the mass of solder paste. Try to keep the overlap 
(the distance the chip sits over the pad/solder paste) the same as the 
extension (the distance that the pad/solder paste extends beyond the 
nominal chip length dimension) .

John Maxwell


>In a message dated 1/15/07 14:16:12, [log in to unmask] writes:
>  
>
>>A re-layout of the boards is not an option.
>>
>>    
>>
>Why? All you really need to do is reduce the size of the fillets by making 
>the soldering pads smaller.
>
>
>Werner
>
>  
>

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