Our assemblers are beginning to run into availability issues with components having tin/lead finishes.  The application is on-wing aircraft, and the boards will be assembled with 63/37 solder.  The question is what qualification testing should be performed to validate the new components?  My initial thoughts are concerned with soldering process to validate solder joint integrity and that peak soldering temperatures do not exceed component ratings. 

Is there a standard that addresses qualification of this type of process change?  What about tin whiskers on the ROHS compliant parts?

Any guidance is appreciated.

Don Vischulis

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