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January 2007

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From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Mon, 15 Jan 2007 09:52:25 -0600
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The data is printed in a table format by the Dage. I will see if I can
go back and get this information from the companies I did this for. No
promises. 

-----Original Message-----
From: Dehoyos, Ramon [mailto:[log in to unmask]] 
Sent: Monday, January 15, 2007 9:13 AM
To: TechNet E-Mail Forum; Stadem, Richard D.
Subject: RE: [TN] SMD Capacitor Shear Strength



	Richard:
		  Thanks for sharing this very good information and
effort. Could you summarize it on a table, if it is not too much to ask?
	Regards,
	Ramon

 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Monday, January 15, 2007 8:54 AM
To: [log in to unmask]
Subject: Re: [TN] SMD Capacitor Shear Strength

From data that I collected when performing solder paste evaluations for
standard 63/37 solder (four different evaluations, four different
companies, using only the data from the solder paste champions):
For an 0603 soldered to immersion silver finish, the shear forces
typically seen for an optimized solder joint are about 2100 grams as
measured using a Dage shear tester. For ENIG this drops to around 1800
grams. You will normally see a range of about 1900 to 2400 grams for
immersion silver finish. For ENIG the range drops to 1200 to 2100 grams
and the variance from the mean is wider. When measuring sheer strength
with the immersion silver finish, nearly all of the solder joints
literally sheared through or tore the pads off of the boards (about 25%
of the pads would release from the board before the solder joint
finished shearing through). For 0603s mounted on ENIG, more than 70% of
the solder joints fractured (broke off) before the solder joint sheared
through, and less than 2% of the pads sheared off. The time required to
shear through to release for the IAg solder joints averaged about 2.3
seconds, whilst the ENIG joints typically fractured at about 1.8
seconds, on average. This data was taken from 28 production board solder
test coupons (7 each of 4 different assembly numbers from two board
vendors) where solder balls were populated on the BGA pads, and 0402
caps, 0603 resistors, and 0806 resistors were populated but only one end
was soldered to the pads. The difference in force/time required to shear
0402s and 0603s was very similar, significantly more was required to
shear the 0806 packages. The force required to shear off the component
is NOT doubled when both ends are soldered, but I am not sure why. Some
of the 0402 caps did not have kapton tape covering one pad, so both ends
were soldered. The Dage shear strength required to shear them off was
about 2100 to 3000 grams. So I would suspect that for an 0603 component
with both ends soldered to IAg you should see a minimum of about 2200
grams, on average.

Peel strength is a more relevant measure of solder joint reliability
than shear strength in terms of reliability. I have not found a way to
easily perform peel strength on small components. The shear data does
provide a pretty good indicator of solder joint IMF brittleness.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Todd, Richard
Sent: Thursday, January 11, 2007 5:04 PM
To: [log in to unmask]
Subject: [TN] SMD Capacitor Shear Strength

I have a question for the oracle . . . 

Does anyone know what is the solder joint shear strength for an 0603
capacitor (assuming standard eutectic solder)?

 

Regards,

 

Rick Todd

Senior Engineer

Process Quality Engineering

 

Panasonic Automotive Systems Company of America

Division of Panasonic Corporation of North America

776 Highway 74 South, Peachtree City, GA 30269

770-515-1087 Direct

678-458-2887 Cell

770-486-2248 Fax

[log in to unmask] <mailto:[log in to unmask]> 

 


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